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The new family of μPOLTM power solutions opens up a new era of power management solutions with higher performance, smallest size, ease of use and simplified integration.

Scalable and highly configurable multi-programmable memory for greater flexibility.

Suitable for big data, machine learning, artificial intelligence (AI), 5G base stations, Internet of Things (IoT), enterprise computing and other applications.

First released at the 2019 APEC show in Anaheim, California.

(Exhibition time: March 18th to 20th, TDK booth number: 811)

*the image is only a reference

TDK Corporation (TSE:6762) has released a new line of μPOLTM DC-DC converters, the industry's most compact, highest power density point-of-load solution for big data, machine learning, artificial intelligence (AI), 5G Base station, Internet of Things (IoT), enterprise computing and other applications.

Instead of using traditional methods of separating integrated circuits and inductors, the series integrates ICs and inductors in a compact module, providing a high-density solution for applications that require thinner power supplies but are space-constrained.

Measuring 3.3 x 3.3 x 1.5 mm, it minimizes the need for external components and maintains maximum performance while providing simplified design and ease of integration. This family offers high-density solutions (1 watt per cubic millimeter) that are 50% smaller than other similar products, minimizing system solution cost, reducing board size, reducing assembly costs, and BOM and PCB costs. . The product operates over a wide junction temperature range (-40 °C to 125 °C).

For many years, TDK has been developing patents related to such innovations (US 9,729,059 and US 10,193,442). FDKday Semi, a group company of TDK, developed μPOLTM. These new solutions integrate high-performance semiconductors into advanced packaging technologies such as chip-on-board package (SESUB) and advanced electronics to enable unique system integration with smaller, smaller form factor through 3D integration. This integration enables TDK to deliver products that are lower in total cost, more efficient, and easier to use than products currently on the market.

μPOLTM technology allows DC-DC converters to be placed side by side on products such as ASICs, FPGAs, and more. Minimize parasitic resistance and inductance by minimizing the distance between the converter and the chipset for fast response and precise adjustment of dynamic load currents.

This product line is suitable for industrial applications, is lead free and complies with the Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Products (ROHS).

The FS1406 is expected to begin mass production in the third quarter of 2019.

From March 18th to 20th, the 2019 APEC exhibition will be held at the Anaheim Convention Center in California. At that time, TDK will showcase the μPOLTM technology at booth #811.

*As of March 2019, TDK survey